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2014 IEEE International Solid-State Circuits Conference (ISSCC)
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The Through Silicon Via (TSV): Three Dimensional Implications for Electrical Overstress (EOS), Electrostatic Discharge (ESD) and Latchup
演講時間:2013年6月28日 (五) 13.30 ~ 15:30 演講地點:國立交通大學工程四館 528 會議室 演講主題: Through Silicon Via (TSV): Three Dimensional Implications for Electrical Overstress (EOS), Electrostatic Discharge (ESD) and Latchup 主講人:Dr. Steven Voldman, IEEE … 閱讀全文… 關於 The Through Silicon Via (TSV): Three Dimensional Implications for Electrical Overstress (EOS), Electrostatic Discharge (ESD) and Latchup
2013 VLSI Design/CAD Symposium
會議名稱: VLSI Design/CAD Symposium 會議日期: 2013/08/06 – 2013/08/09 會議地點: 高雄義大皇冠假日飯店 Important dates 2013/05/24 Deadline for Submission of Papers 2013/06/27 Notification of Paper Acceptance Conference website: http://www.ticd.org.tw/vlsicad2013 … 閱讀全文… 關於 2013 VLSI Design/CAD Symposium
2013 International SoC Design Conference (ISOCC)
會議名稱: International SoC Design Conference (ISOCC) 會議日期: 2013/11/17 – 2013/11/19 會議地點: BEXCO Convention Hall, Pusan, Korea Important dates 2013/07/21 Deadline for Submission of Papers 2013/09/01 Notification of Paper Acceptance Conference website: http://www.isocc.org … 閱讀全文… 關於 2013 International SoC Design Conference (ISOCC)