Electrostatic Discharge (ESD) and electromigration are critical issues that significantly impact the reliability of integrated circuits (ICs). While both of these phenomena have been studied independently, the combination of the two, ESD-induced electromigration, has received less attention, potentially compromising IC reliability. This work analyzes various types of metal with … 閱讀全文… 關於 Characterization of ESD-Induced Electromigration on CMOS Metallization in On-Chip ESD Protection Circuit